MEMS Technology |
Index - MEMS |
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IntroductionDiCon Fiberoptics has been developing and perfecting our core MEMS technology since 1997, and we introduced our first commercial MEMS product in 2000, a MEMS VOA (Variable Optical Attenuator). Unlike most of the other Optical MEMS companies, who focused on large port-count Optical Cross- Connects (OXCs), DiCon chose to focus initially on higher-volume individual components, such as VOAs and MEMS Switches. This allowed us to perfect our processes for producing MEMS devices in high volumes, with high quality and reliability, as well as high manufacturing yield.In-House Wafer ProcessingIn contrast to other sellers of optical MEMS components who use foundries for the production of MEMS chips, DiCon does its own wafer processing at our inhouse MEMS fab and clean room, located at our Richmond, CA headquarters facility. This allows us to maintain very tight control of our wafer fabrication and testing processes, and also enables a very tight coupling between design and manufacturing. This in turn allows DiCon to continuously improve the performance and quality of our MEMS-based products, through the combination of design and process improvements. |
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 Copyright © 2006 DiCon Fiberoptics, Inc. All rights reserved. |
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